APA (7th ed.) Citation

Lim, C. H. (2017). Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages.

Chicago Style (17th ed.) Citation

Lim, Chong Hooi. Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages. 2017.

MLA (9th ed.) Citation

Lim, Chong Hooi. Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages. 2017.

Warning: These citations may not always be 100% accurate.