Development Of Ternary Ni-Ag-P And Ni-Cu-P Using Electroless Coating On Copper Substrate

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Development Of Ternary Ni-Ag-P And Ni-Cu-P Using Electroless Coating On Copper Substrate

Current functional test of assembled device in semiconductor industry use thermal interface media but it occasionally caused cosmetic defects such as stain or scratch mark. A possible solution to eliminate the undesired defects is by improving the nickel-phosphorus (Ni-P) coating currently applied o...

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Bibliographic Details
Main Author:	Md Sani, Nur Ariffah
Format:	Thesis
Language:	English
Published:	2015
Subjects:	T Technology (General) TA401-492 Materials of engineering and construction. Mechanics of materials
Online Access:	http://eprints.usm.my/46917/ http://eprints.usm.my/46917/1/Development%20Of%20Ternary%20Ni-Ag-P%20And%20Ni-Cu-P%20Using%20Electroless%20Coating%20On%20Copper%20Substrate.pdf

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