Fabrication And Properties Of Electromagnetic Interferences Shielding Epoxy Composites For Electronic Packaging Application
Rapid development in wireless commination devices was lead to seriousness in electromagnetic pollution. The main aim of this study is develop an effective electromagnetic interferences (EMI) shielding composites for electronic packaging application. In the present study, an EMI shielding epoxy compo...
| Main Author: | Phan, Chee Hong |
|---|---|
| Format: | Thesis |
| Language: | English |
| Published: |
2015
|
| Subjects: | |
| Online Access: | http://eprints.usm.my/46762/ http://eprints.usm.my/46762/1/Fabrication%20And%20Properties%20Of%20Electromagnetic%20Interferences%20Shielding%20Epoxy%20Composites%20For%20Electronic%20Packaging%20Application.pdf |
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