Effect Of Indium Addition On Microstructure, Wettability, Shear Strength And Creep Behavior Of Sn100c Solder

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Effect Of Indium Addition On Microstructure, Wettability, Shear Strength And Creep Behavior Of Sn100c Solder

Due to environmental concern of lead toxicity, the use of lead-free solder has been widely used in electronic packing industries. In finding alternative of lead-free solder to replace the current lead solder, the lead-free solder should have a melting point close to lead solder (183°C), has good wet...

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Bibliographic Details
Main Author:	Abdullah, Nabihah
Format:	Thesis
Language:	English
Published:	2019
Subjects:	T Technology TA401-492 Materials of engineering and construction. Mechanics of materials
Online Access:	http://eprints.usm.my/46741/ http://eprints.usm.my/46741/1/Effect%20Of%20Indium%20Addition%20On%20Microstructure%2C%20Wettability%2C%20Shear%20Strength%20And%20Creep%20Behavior%20Of%20Sn100c%20Solder.pdf

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