Effect Of Indium On Microstructure And Intermetallic Compound Formation During Isothermal Aging Of Sncu Solder Alloy

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Effect Of Indium On Microstructure And Intermetallic Compound Formation During Isothermal Aging Of Sncu Solder Alloy

Solder is the interconnect material serving both electrical and mechanical connections between components and substrate in electronic devices. Concern over the toxicity of lead sparked intense focus on finding alternative lead-free solders to replace the traditional Sn-Pb solder. Among the lead-free...

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Bibliographic Details
Main Author:	Khusaini, Nur Nadirah Mohd
Format:	Thesis
Language:	English
Published:	2018
Subjects:	T Technology TA401-492 Materials of engineering and construction. Mechanics of materials
Online Access:	http://eprints.usm.my/46688/ http://eprints.usm.my/46688/1/Effect%20Of%20Indium%20On%20Microstructure%20And%20Intermetallic%20Compound%20Formation%20During%20Isothermal%20Aging%20Of%20Sncu%20Solder%20Alloy.pdf

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