Numerical Analysis During Encapsulation Process Of Molded Underfill With Multi Flip Chip Package

Numerical Analysis During Encapsulation Process Of Molded Underfill With Multi Flip Chip Package

Nowadays, the technology of Integrated Circuit (IC) packaging has become a sophisticated design in addition to maintaining reliability and quality. Flip Chip Scale Package (CSP) is one of the IC chips which has a wafer-level packaged with spherical solder bump located on a grid with a pre-defined pi...

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Bibliographic Details
Main Author: Azmi, Muhammad Afiq
Format: Thesis
Language:English
Published: 2018
Subjects:
T Technology
TA401-492 Materials of engineering and construction. Mechanics of materials
Online Access:http://eprints.usm.my/46686/
http://eprints.usm.my/46686/1/Numerical%20Analysis%20During%20Encapsulation%20Process%20Of%20Molded%20Underfill%20With%20Multi%20Flip%20Chip%20Package.pdf

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