APA (7th ed.) Citation

Azmi, M. A. (2018). Numerical Analysis During Encapsulation Process Of Molded Underfill With Multi Flip Chip Package.

Chicago Style (17th ed.) Citation

Azmi, Muhammad Afiq. Numerical Analysis During Encapsulation Process Of Molded Underfill With Multi Flip Chip Package. 2018.

MLA (9th ed.) Citation

Azmi, Muhammad Afiq. Numerical Analysis During Encapsulation Process Of Molded Underfill With Multi Flip Chip Package. 2018.

Warning: These citations may not always be 100% accurate.