Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
Properties of Sn-9Zn and Bi-48.8In-19.6Sn solder alloys have been investigated along with Sn-40Pb as a reference. The solder alloys where characterized (density, XRD, SEM, CTE and DSC) before the atomization process. The characterized solder alloys are then gas atomized at a pressure of 0.4 MPa and...
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| Format: | Thesis |
| Language: | English |
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2012
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| Online Access: | http://eprints.usm.my/45529/ http://eprints.usm.my/45529/1/MOHAMMED%20LUAY%20BAKIR_HJ.pdf |
| _version_ | 1848880357438390272 |
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| author | Bakir, Mohammed Luay |
| author_facet | Bakir, Mohammed Luay |
| author_sort | Bakir, Mohammed Luay |
| building | USM Institutional Repository |
| collection | Online Access |
| description | Properties of Sn-9Zn and Bi-48.8In-19.6Sn solder alloys have been investigated along with Sn-40Pb as a reference. The solder alloys where characterized (density, XRD, SEM, CTE and DSC) before the atomization process. The characterized solder alloys are then gas atomized at a pressure of 0.4 MPa and superheat temperature of 20% above their respective liquidus temperature obtained from the DSC analysis. Solder powders are then sieved and characterized using SEM and particle size analyzer. The characterized powders of size +75-150 μm are then mixed with zinc chloride flux at different metal to flux ratios (90:10, 80:20, 70:30, and 60:40). The wetting properties (spreading and contact angle), interfacial reactions and mechanical property (shear test) of the solder pastes are then studied. The Sn-40Pb solder paste demonstrates the highest spreading and lowest contact angle compared to Sn-9Zn and Bi-48.8In-19.6Sn. At the solder/substrate interface, the intermetallic compound Cu6Sn5 was formed for both Sn-40Pb and Bi-48.8In-19.6Sn regardless of metal content and Sn-Cu-Zn intermetallic compound is formed at the Sn-9Zn (90 wt%)/Cu interface. The highest joint shear strength was achieved by Sn-9Zn (90 wt%) at a value of 45.3 MPa. The shear strength increased as the metal content increases for the Sn-40Pb and Bi-48.8In-19.6Sn solder alloys. The shear strength of Sn-40Pb (90 wt%) is higher than the shear strength of Sn-40Pb (80 wt%) and the same goes for Bi-48.8In-19.6Sn solder alloy where the shear strength of Bi-48.8In-19.6Sn (90 wt%) is higher than the shear strength of Bi-48.8In-19.6Sn (80 wt%). |
| first_indexed | 2025-11-15T18:01:50Z |
| format | Thesis |
| id | usm-45529 |
| institution | Universiti Sains Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T18:01:50Z |
| publishDate | 2012 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | usm-455292019-09-24T02:56:49Z http://eprints.usm.my/45529/ Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application Bakir, Mohammed Luay TN1-997 Mining engineering. Metallurgy Properties of Sn-9Zn and Bi-48.8In-19.6Sn solder alloys have been investigated along with Sn-40Pb as a reference. The solder alloys where characterized (density, XRD, SEM, CTE and DSC) before the atomization process. The characterized solder alloys are then gas atomized at a pressure of 0.4 MPa and superheat temperature of 20% above their respective liquidus temperature obtained from the DSC analysis. Solder powders are then sieved and characterized using SEM and particle size analyzer. The characterized powders of size +75-150 μm are then mixed with zinc chloride flux at different metal to flux ratios (90:10, 80:20, 70:30, and 60:40). The wetting properties (spreading and contact angle), interfacial reactions and mechanical property (shear test) of the solder pastes are then studied. The Sn-40Pb solder paste demonstrates the highest spreading and lowest contact angle compared to Sn-9Zn and Bi-48.8In-19.6Sn. At the solder/substrate interface, the intermetallic compound Cu6Sn5 was formed for both Sn-40Pb and Bi-48.8In-19.6Sn regardless of metal content and Sn-Cu-Zn intermetallic compound is formed at the Sn-9Zn (90 wt%)/Cu interface. The highest joint shear strength was achieved by Sn-9Zn (90 wt%) at a value of 45.3 MPa. The shear strength increased as the metal content increases for the Sn-40Pb and Bi-48.8In-19.6Sn solder alloys. The shear strength of Sn-40Pb (90 wt%) is higher than the shear strength of Sn-40Pb (80 wt%) and the same goes for Bi-48.8In-19.6Sn solder alloy where the shear strength of Bi-48.8In-19.6Sn (90 wt%) is higher than the shear strength of Bi-48.8In-19.6Sn (80 wt%). 2012-01 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/45529/1/MOHAMMED%20LUAY%20BAKIR_HJ.pdf Bakir, Mohammed Luay (2012) Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application. Masters thesis, Universiti Sains Malaysia. |
| spellingShingle | TN1-997 Mining engineering. Metallurgy Bakir, Mohammed Luay Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application |
| title | Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application |
| title_full | Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application |
| title_fullStr | Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application |
| title_full_unstemmed | Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application |
| title_short | Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application |
| title_sort | atomized lead free solder alloys for solder paste product for electronic application |
| topic | TN1-997 Mining engineering. Metallurgy |
| url | http://eprints.usm.my/45529/ http://eprints.usm.my/45529/1/MOHAMMED%20LUAY%20BAKIR_HJ.pdf |