Fabrication And Properties Of Silica-Epoxy Thin Film Composite

With the increasing interest in high density electronics packaging, dimensional scaling becomes the key to evolution. In this study, epoxy thin film composites with silica fillers were fabricated using spin coating process. In the first part of this research, the mechanical and thermal properties of...

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Main Author: Foo, Yin Lin Evon
Format: Thesis
Language:English
Published: 2012
Subjects:
Online Access:http://eprints.usm.my/44803/
http://eprints.usm.my/44803/1/FOO%20YIN%20LIN%20EVON.pdf
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author Foo, Yin Lin Evon
author_facet Foo, Yin Lin Evon
author_sort Foo, Yin Lin Evon
building USM Institutional Repository
collection Online Access
description With the increasing interest in high density electronics packaging, dimensional scaling becomes the key to evolution. In this study, epoxy thin film composites with silica fillers were fabricated using spin coating process. In the first part of this research, the mechanical and thermal properties of the thin film composites using micron-silica (µ-Si) and nano-silica (n-Si) fillers were compared. Low loading of n-Si thin film composites was found to have the ability to achieve equivalent tensile and thermal properties compared to the highly loaded µ-Si thin film composite. With higher surface area to volume ratio, n-Si shows its capability to achieve a substantial performance with-Si.
first_indexed 2025-11-15T17:58:40Z
format Thesis
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institution Universiti Sains Malaysia
institution_category Local University
language English
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publishDate 2012
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spelling usm-448032019-07-02T01:31:45Z http://eprints.usm.my/44803/ Fabrication And Properties Of Silica-Epoxy Thin Film Composite Foo, Yin Lin Evon TN1-997 Mining engineering. Metallurgy With the increasing interest in high density electronics packaging, dimensional scaling becomes the key to evolution. In this study, epoxy thin film composites with silica fillers were fabricated using spin coating process. In the first part of this research, the mechanical and thermal properties of the thin film composites using micron-silica (µ-Si) and nano-silica (n-Si) fillers were compared. Low loading of n-Si thin film composites was found to have the ability to achieve equivalent tensile and thermal properties compared to the highly loaded µ-Si thin film composite. With higher surface area to volume ratio, n-Si shows its capability to achieve a substantial performance with-Si. 2012-06 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/44803/1/FOO%20YIN%20LIN%20EVON.pdf Foo, Yin Lin Evon (2012) Fabrication And Properties Of Silica-Epoxy Thin Film Composite. Masters thesis, Universiti Sains Malaysia.
spellingShingle TN1-997 Mining engineering. Metallurgy
Foo, Yin Lin Evon
Fabrication And Properties Of Silica-Epoxy Thin Film Composite
title Fabrication And Properties Of Silica-Epoxy Thin Film Composite
title_full Fabrication And Properties Of Silica-Epoxy Thin Film Composite
title_fullStr Fabrication And Properties Of Silica-Epoxy Thin Film Composite
title_full_unstemmed Fabrication And Properties Of Silica-Epoxy Thin Film Composite
title_short Fabrication And Properties Of Silica-Epoxy Thin Film Composite
title_sort fabrication and properties of silica-epoxy thin film composite
topic TN1-997 Mining engineering. Metallurgy
url http://eprints.usm.my/44803/
http://eprints.usm.my/44803/1/FOO%20YIN%20LIN%20EVON.pdf