Simulation Of Underfill Encapsulation Of Electrionic Packaging Using The Lattice-Boltzmann Method

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Simulation Of Underfill Encapsulation Of Electrionic Packaging Using The Lattice-Boltzmann Method

Kebanyak kajian berasaskan kaedah isipadu terhingga (FVM) telah dilaksanakan untuk mengoptimumkan dan memperbaiki proses pengkapsulan isian bawah. Namun, terdapat kajian yang terhad telah dilaksanakan dengan kaedah kekisi-Boltzmann (LBM) untuk aplikasi yang berkaitan dengan pengkapsulan isian bawah....

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Bibliographic Details
Main Author:	Gan, Zhong Li
Format:	Thesis
Language:	English
Published:	2018
Subjects:	T Technology TJ1-1570 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/44590/ http://eprints.usm.my/44590/1/Simulation%20Of%20Underfill%20Encapsulation%20Of%20Electrionic%20Packaging%20Using%20The%20Lattice-Boltzmann%20Method.pdf

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