Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes

A large amount of heat trapped inside Light Emitting Diode (LED) package is the consequence of large thermal resistance between the heat source and the heat sink. These large thermal resistances created a huge amount of heat accumulated inside the LED package resulting in poorer luminous efficiency,...

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Main Author: Mah, Jian Wen
Format: Thesis
Language:English
Published: 2018
Subjects:
Online Access:http://eprints.usm.my/44223/
http://eprints.usm.my/44223/1/MAH%20JIAN%20WEN.pdf
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author Mah, Jian Wen
author_facet Mah, Jian Wen
author_sort Mah, Jian Wen
building USM Institutional Repository
collection Online Access
description A large amount of heat trapped inside Light Emitting Diode (LED) package is the consequence of large thermal resistance between the heat source and the heat sink. These large thermal resistances created a huge amount of heat accumulated inside the LED package resulting in poorer luminous efficiency, shorter life time, shifting of emission wavelength and reliability issues. Typically, the junction temperature of the LED was found to be approximately 120°C on 250mA of applied forward current. In this project, pure and four different metal-doped ZnO thick films were deposited on Aluminium substrate by screen printing technique using nano-crystalline powder synthesized from co-precipitation method.
first_indexed 2025-11-15T17:56:14Z
format Thesis
id usm-44223
institution Universiti Sains Malaysia
institution_category Local University
language English
last_indexed 2025-11-15T17:56:14Z
publishDate 2018
recordtype eprints
repository_type Digital Repository
spelling usm-442232019-04-26T01:35:25Z http://eprints.usm.my/44223/ Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes Mah, Jian Wen QC1 Physics (General) A large amount of heat trapped inside Light Emitting Diode (LED) package is the consequence of large thermal resistance between the heat source and the heat sink. These large thermal resistances created a huge amount of heat accumulated inside the LED package resulting in poorer luminous efficiency, shorter life time, shifting of emission wavelength and reliability issues. Typically, the junction temperature of the LED was found to be approximately 120°C on 250mA of applied forward current. In this project, pure and four different metal-doped ZnO thick films were deposited on Aluminium substrate by screen printing technique using nano-crystalline powder synthesized from co-precipitation method. 2018-04 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/44223/1/MAH%20JIAN%20WEN.pdf Mah, Jian Wen (2018) Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes. Masters thesis, Universiti Sains Malaysia.
spellingShingle QC1 Physics (General)
Mah, Jian Wen
Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes
title Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes
title_full Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes
title_fullStr Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes
title_full_unstemmed Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes
title_short Fabrication Of Screen Printed Doped Zinc Oxide Thick Film On Metal Substrate As Heat Sink For High Power Light Emitting Diodes
title_sort fabrication of screen printed doped zinc oxide thick film on metal substrate as heat sink for high power light emitting diodes
topic QC1 Physics (General)
url http://eprints.usm.my/44223/
http://eprints.usm.my/44223/1/MAH%20JIAN%20WEN.pdf