Investigation Of The Fluid/Structure Interaction In Moulded Underfill Process

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Investigation Of The Fluid/Structure Interaction In Moulded Underfill Process

The rapid development of portable electronic devices, such as iPad, iPhone, iPod, and laptop, propels the integrated circuit (IC) packaging technology toward miniaturization characterized by high capacity and compactness of IC package. The scaling down of IC package size has given challenges to the...

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Bibliographic Details
Main Author:	Khor, Chu Yee
Format:	Thesis
Language:	English
Published:	2013
Subjects:	TJ1-1570 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/43379/ http://eprints.usm.my/43379/1/Khor%20Chu%20Yee24.pdf

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