Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders

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Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders

Due to the environmental concern for lead toxicity, the use of lead-free solder has been widespread in electronic packaging industries. In order for lead-free solder to replace the current lead solder, lead-free solder should have as close melting point as lead solder (1830C) and also has good wetta...

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Bibliographic Details
Main Author:	Wahab, Abdul Karim Abdul
Format:	Thesis
Language:	English
Published:	2011
Subjects:	TN1-997 Mining engineering. Metallurgy
Online Access:	http://eprints.usm.my/43190/ http://eprints.usm.my/43190/1/ABDUL%20KARIM%20ABDUL%20WAHAB.pdf

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