Study Of Wettability And Corrosion Behavior Of Sn-37pb, Sn-8zn-3bi And Sn-3ag-0.5cu Solders
Lead-based solders have been used extensively for chip-attach and surface-mount processes in the electronic industry, and in marine applications. However, because of toxicity issues related to lead, efforts to develop a cost-effective lead-free replacement have been ongoing. This work investi...
| Main Author: | Ridhai, Mohammed Noori |
|---|---|
| Format: | Thesis |
| Language: | English |
| Published: |
2010
|
| Subjects: | |
| Online Access: | http://eprints.usm.my/43019/ http://eprints.usm.my/43019/1/Mohammed_Noori_Ridha24.pdf |
Similar Items
Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2013)
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2013)
Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
by: Azmah Hanim, Mohamad Ariff, et al.
Published: (2013)
by: Azmah Hanim, Mohamad Ariff, et al.
Published: (2013)
Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
by: Hashim, Md. Amin
Published: (2011)
by: Hashim, Md. Amin
Published: (2011)
Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2017)
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2017)
Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
by: Tai, Siew Fong
Published: (2003)
by: Tai, Siew Fong
Published: (2003)
Investigations On The Properties Of Sn-8zn-3Bi Lead-Free And Sn-37Pb Eutectic Solder Alloys [TS610. D928 2005 f rb] [Microfiche 8175].
by: Duong, Ngoc Binh
Published: (2005)
by: Duong, Ngoc Binh
Published: (2005)
Separation of Sn from waste Pb-free Sn-Ag-Cu solder in hydrochloric acid solution with ferric chloride
by: Lee, S., et al.
Published: (2015)
by: Lee, S., et al.
Published: (2015)
Bismuth addition in Sn-Ag-Cu lead-free solder
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2024)
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2024)
Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging
by: Mat Hussin, Nur Liyana, et al.
Published: (2015)
by: Mat Hussin, Nur Liyana, et al.
Published: (2015)
Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
by: Mayappan, Ramani
Published: (2007)
by: Mayappan, Ramani
Published: (2007)
Recovery of Sn, Ag and Cu from waste Pb-free solder using nitric acid leaching
by: Yoo, Kyoungkeun, et al.
Published: (2012)
by: Yoo, Kyoungkeun, et al.
Published: (2012)
Separation of Cu, Sn, Pb from copper scrap coated with Sn and Pb
by: Yoo, Kyoungkeun, et al.
Published: (2015)
by: Yoo, Kyoungkeun, et al.
Published: (2015)
Characterization And Corrosion Behaviour Of 96.5sn-3.0ag- 0.5cu Solder On Cu Substrate At Different Reflow Reactions
by: Lee , Liu Mei
Published: (2013)
by: Lee , Liu Mei
Published: (2013)
Characterization and corrosion behaviour of 96.5Sn-3.0Ag-0.5Cu solder on Cu substrate at different reflow reactions
by: Lee, Liu Mei
Published: (2013)
by: Lee, Liu Mei
Published: (2013)
Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag 0.5Cu solder alloys bearing Fe and Bi / Mohammad Hossein Mahdavifard
by: Mohammad Hossein, Mahdavifard
Published: (2017)
by: Mohammad Hossein, Mahdavifard
Published: (2017)
A review on mechanical properties of SnAgCu/Cu joint using laser soldering
by: Nabila, Tamar Jaya, et al.
Published: (2018)
by: Nabila, Tamar Jaya, et al.
Published: (2018)
Isothermal Aging Of Sn-3.0ag-0.5cu And Sn100c Solder Alloys Processed Via Equal Channel Angular Pressing
by: Baser, Muhammad Fadlin Hazim
Published: (2020)
by: Baser, Muhammad Fadlin Hazim
Published: (2020)
A simulation study on interfacial reaction between Sn3Ag0.5Cu and Sn0.7Cu using different substrates after reflow soldering
by: M. H., Mohd Zaki, et al.
Published: (2023)
by: M. H., Mohd Zaki, et al.
Published: (2023)
Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
by: M.A., Rabiatul Adawiyah, et al.
Published: (2018)
by: M.A., Rabiatul Adawiyah, et al.
Published: (2018)
Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn / Leong Yee Mei
by: Leong , Yee Mei
Published: (2020)
by: Leong , Yee Mei
Published: (2020)
Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad
by: Mayappan, Ramani, et al.
Published: (2010)
by: Mayappan, Ramani, et al.
Published: (2010)
Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)
by: Chellvarajoo, Srivalli
Published: (2016)
Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)
by: Chellvarajoo, Srivalli
Published: (2016)
Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching
by: Jeon, S., et al.
Published: (2017)
by: Jeon, S., et al.
Published: (2017)
The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating
by: Maliessa Nabilah, Mazelan
Published: (2023)
by: Maliessa Nabilah, Mazelan
Published: (2023)
Corrosion Of Nanocomposite Sn/Ag Coating On Copper Substrate
by: Azmi, Nurul Atiqah
Published: (2022)
by: Azmi, Nurul Atiqah
Published: (2022)
Studies on intermetallics and physical properties of Sn-3.5Ag-1.0Cu lead free solder with Zn additive / Iziana Yahya
by: Yahya, Iziana
Published: (2016)
by: Yahya, Iziana
Published: (2016)
Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)
Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)
Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
by: Nor Adhila Muhammad,, et al.
Published: (2014)
by: Nor Adhila Muhammad,, et al.
Published: (2014)
Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2023)
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2023)
Microstructural evaluation of sn3.0ag0.5cu solder alloy fabricated via powder metallurgy method
by: Nadhrah, Murad
Published: (2021)
by: Nadhrah, Murad
Published: (2021)
Effect Of Grain Refinement Process Using Equal Channel Angular Pressing On The Properties And Corrosion Behaviour Of Sn-3.0ag-0.5Cu Solder
by: Abu Bakar, Nur Adriana Nazifa
Published: (2019)
by: Abu Bakar, Nur Adriana Nazifa
Published: (2019)
Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
by: Mayappan, Ramani
Published: (2007)
by: Mayappan, Ramani
Published: (2007)
Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2016)
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2016)
Effect of coating element on joining stability of Sn-0.3Ag-0.7Cu solder joint due to aging test
by: Atiqah Mohd Afdzaluddin,, et al.
Published: (2020)
by: Atiqah Mohd Afdzaluddin,, et al.
Published: (2020)
Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering
by: Muhammad Asyraf, Abdullah, et al.
Published: (2023)
by: Muhammad Asyraf, Abdullah, et al.
Published: (2023)
Effect Of Indium Addition On Microstructure, Wettability, Shear Strength And Creep Behavior Of Sn100c Solder
by: Abdullah, Nabihah
Published: (2019)
by: Abdullah, Nabihah
Published: (2019)
Effect of indium addition on microstructure, wettability, shear strength and creep behavior of sn100c solder
by: Abdullah, Nabihah
Published: (2019)
by: Abdullah, Nabihah
Published: (2019)
Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
by: Zetty Akhtar, Abd Malek, et al.
Published: (2014)
by: Zetty Akhtar, Abd Malek, et al.
Published: (2014)
Similar Items
-
Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2013) -
Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
by: Azmah Hanim, Mohamad Ariff, et al.
Published: (2013) -
Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
by: Hashim, Md. Amin
Published: (2011) -
Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2017) -
Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
by: Tai, Siew Fong
Published: (2003)