Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures

QR Code

Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures

Interconnect materials are used to connect surface mounting components and other passive and discrete circuit components on to copper pads or lands, and in holes on the printed circuit boards. Presently, the industrial practice is using thermal cycling as a method for reliability testing of circuit...

Full description

Bibliographic Details
Main Author:	Hashim, Md. Amin
Format:	Thesis
Language:	English
Published:	2011
Subjects:	TN1-997 Mining engineering. Metallurgy
Online Access:	http://eprints.usm.my/42008/ http://eprints.usm.my/42008/1/MD_AMIN_HASHIM.pdf

Similar Items

Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: materials and technologies
by: Dele-Afolabi, T.T., et al.
Published: (2023)

Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
by: Tai, Siew Fong
Published: (2003)

Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint
by: Bashir, M. Nasir, et al.
Published: (2022)

Effect Of Indium Addition On Microstructure, Wettability, Shear Strength And Creep Behavior Of Sn100c Solder
by: Abdullah, Nabihah
Published: (2019)

Effect of indium addition on microstructure, wettability, shear strength and creep behavior of sn100c solder
by: Abdullah, Nabihah
Published: (2019)

Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2013)

Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
by: Azmah Hanim, Mohamad Ariff, et al.
Published: (2013)

Isothermal Aging Of Sn-3.0ag-0.5cu And Sn100c Solder Alloys Processed Via Equal Channel Angular Pressing
by: Baser, Muhammad Fadlin Hazim
Published: (2020)

Study Of Wettability And Corrosion Behavior Of Sn-37pb, Sn-8zn-3bi And Sn-3ag-0.5cu Solders
by: Ridhai, Mohammed Noori
Published: (2010)

Effect Of Adding Indium And Zinc Alloying Elements To Creep Behavior Of Sn-0.7cu Solder Alloy
by: Tan, Joo Kean
Published: (2017)

Investigations On The Properties Of Sn-8zn-3Bi Lead-Free And Sn-37Pb Eutectic Solder Alloys [TS610. D928 2005 f rb] [Microfiche 8175].
by: Duong, Ngoc Binh
Published: (2005)

Separation of Sn from waste Pb-free Sn-Ag-Cu solder in hydrochloric acid solution with ferric chloride
by: Lee, S., et al.
Published: (2015)

Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
by: Mayappan, Ramani
Published: (2007)

Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2016)

Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue
by: Mohd Nasir Tamin,, et al.
Published: (2008)

Numerical modeling of cyclic stress-strain behavior Of sn-pb solder joint during thermal fatigue
by: Tamin, M N, et al.
Published: (2005)

Bismuth addition in Sn-Ag-Cu lead-free solder
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2024)

Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging
by: Mat Hussin, Nur Liyana, et al.
Published: (2015)

Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
by: M.A., Rabiatul Adawiyah, et al.
Published: (2018)

Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package
by: Shaffiar, Norhashimah, et al.
Published: (2010)

Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering
by: Muhammad Asyraf, Abdullah, et al.
Published: (2023)

Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
by: Zetty Akhtar, Abd Malek, et al.
Published: (2014)

Separation of Cu, Sn, Pb from copper scrap coated with Sn and Pb
by: Yoo, Kyoungkeun, et al.
Published: (2015)

Keberkesanan Modul Multimedia Kimia Organik: Mekanisme Tindak Balas Sn1 Dan Sn2 (The Effectiveness Of Multimedia Organic Chemistry Module: Sn1 And Sn2 Reaction Mechanism)
by: Syed Abdul Azziz, Saripah Salbiah, et al.
Published: (2013)

Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders
by: Wahab, Abdul Karim Abdul
Published: (2011)

Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
by: Nor Adhila Muhammad,, et al.
Published: (2014)

Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2013)

Sandwich-like CNTs@SnO2/SnO/Sn anodes on three-dimensional Ni foam substrate for lithium ion batteries
by: Zhang, J., et al.
Published: (2016)

Effect of heat treatment temperature on SN-0.7CU solders material on microstructure
by: Nabhan, Ismil
Published: (2007)

Analisis struktur saput tipis aloi eutektik SnSe-SnSe2
by: D. Hutagalung, Sabar, et al.
Published: (1996)

Impact of different isothermal aging conditions on the IMC layer growth and shear strength of MWCNT-reinforced Sn-5Sb solder composites on Cu substrate
by: T. Temitope, Dele Afolabi, et al.
Published: (2019)

A simulation study on interfacial reaction between Sn3Ag0.5Cu and Sn0.7Cu using different substrates after reflow soldering
by: M. H., Mohd Zaki, et al.
Published: (2023)

Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
by: Mayappan, Ramani
Published: (2007)

Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy
by: Siti Faqihah, Roduan, et al.
Published: (2023)

A review on mechanical properties of SnAgCu/Cu joint using laser soldering
by: Nabila, Tamar Jaya, et al.
Published: (2018)

Effect of bamboo charcoal additions on shear strength and fracture behaviour of SN-BI solder joint
by: Chai, Jing Yee
Published: (2024)

Keberkesanan modul multimedia kimia organik: mekanisme tindak balas SN1 dan SN2
by: Syed Abdul Azziz, Saripah Salbiah, et al.
Published: (2013)

Synthesis, processing and microstructural characterization of CaSnO3 and SrSnO3 ceramics
by: Azad, Abdul-Majeed, et al.
Published: (1999)

Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag 0.5Cu solder alloys bearing Fe and Bi / Mohammad Hossein Mahdavifard
by: Mohammad Hossein, Mahdavifard
Published: (2017)

Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures.
by: Ariff Syakirin, Ghazalli
Published: (2007)