Characterization Of Ti/TiN/AlCu Film Stack Prepared By Physical Vapor Deposition

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Characterization Of Ti/TiN/AlCu Film Stack Prepared By Physical Vapor Deposition

Physical vapor deposition (PVD) method is widely used in semiconductor industry in metallic film deposition process. It has been found that the metallic film properties are influenced by the parameter change in the PVD sputtering machine. Ionized physical vapor deposition (I-PVD) came about when ele...

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Bibliographic Details
Main Author:	Leow, Mun Tyng
Format:	Thesis
Language:	English
Published:	2012
Subjects:	QC1 Physics (General)
Online Access:	http://eprints.usm.my/41945/ http://eprints.usm.my/41945/1/LEOW_MUN_TYNG.pdf

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