Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging

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Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging

Thermal analysis in single die and stacked dies electronic packaging for portable communication devices is very important due to lack of real estate for active cooling. Recent research had focused on active cooling and neglected the low cost passive cooling by optimizing the architecture of package...

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Bibliographic Details
Main Author:	Law, Ruen Ching
Format:	Thesis
Language:	English
Published:	2012
Subjects:	TJ1-1570 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/41921/ http://eprints.usm.my/41921/1/LAW_RUEN_CHING.pdf

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