APA (7th ed.) Citation

Law, R. C. (2012). Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging.

Chicago Style (17th ed.) Citation

Law, Ruen Ching. Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging. 2012.

MLA (9th ed.) Citation

Law, Ruen Ching. Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging. 2012.

Warning: These citations may not always be 100% accurate.