CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing
Methods

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CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods

The major trend in electronic industry is to make the products smarter, lighter, functional and highly compact, at the same time cheaper. This trend has necessitated stringent packaging requirements and the flip-chip technology has emerged as a promising option to tackle this issue. However, a seri...

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Bibliographic Details
Main Author:	Khor , Chu Yee
Format:	Thesis
Language:	English
Published:	2010
Subjects:	TJ1-1570 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/41905/ http://eprints.usm.my/41905/1/KHOR_CHU_YEE.pdf

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