APA (7th ed.) Citation

Khor , C. Y. (2010). CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods.

Chicago Style (17th ed.) Citation

Khor , Chu Yee. CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods. 2010.

MLA (9th ed.) Citation

Khor , Chu Yee. CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods. 2010.

Warning: These citations may not always be 100% accurate.