Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process

Investigation Of Process Time-Delay On Polyimide With Different Thicknesses For Photolithography Process

Polyimides (PI), particularly photosensitive polyimide (PSPI) has wide applications in semiconductor industries due to their good thermal, mechanical and chemical properties. During photolithography process, there might be time delays from coat to expose and from expose to develop. The time delay co...

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Bibliographic Details
Main Author: Ang , Karen Huei Ling
Format: Thesis
Language:English
Published: 2011
Subjects:
TN1-997 Mining engineering. Metallurgy
Online Access:http://eprints.usm.my/41879/
http://eprints.usm.my/41879/1/KAREN_ANG_HUEI_LING.pdf

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