Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates

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Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates

Pencirian aloi pateri tanpa plumbum (Sn-9Zn, Sn-8Zn-3Bi dan Sn-3Ag-0.5Cu) ke atas substrat kumprum tanpa salutan dan yang disalut dengan Au-Ni telah dilakukan. Keputusan menunjukkan kebolehbasahan bagi ketiga-tiga aloi pateri ke atas substrat kuprum adalah baik pada suhu yang telah ditetapkan. Ukura...

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Bibliographic Details
Main Author:	Binh, Duong Ngoc
Format:	Thesis
Language:	English
Published:	2009
Subjects:	TN1-997 Mining engineering. Metallurgy
Online Access:	http://eprints.usm.my/41512/ http://eprints.usm.my/41512/1/Duong_Ngoc_Binh24.pdf

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