Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
Pencirian aloi pateri tanpa plumbum (Sn-9Zn, Sn-8Zn-3Bi dan Sn-3Ag-0.5Cu) ke atas substrat kumprum tanpa salutan dan yang disalut dengan Au-Ni telah dilakukan. Keputusan menunjukkan kebolehbasahan bagi ketiga-tiga aloi pateri ke atas substrat kuprum adalah baik pada suhu yang telah ditetapkan. Ukura...
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| Format: | Thesis |
| Language: | English |
| Published: |
2009
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| Online Access: | http://eprints.usm.my/41512/ http://eprints.usm.my/41512/1/Duong_Ngoc_Binh24.pdf |
| _version_ | 1848879307708956672 |
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| author | Binh, Duong Ngoc |
| author_facet | Binh, Duong Ngoc |
| author_sort | Binh, Duong Ngoc |
| building | USM Institutional Repository |
| collection | Online Access |
| description | Pencirian aloi pateri tanpa plumbum (Sn-9Zn, Sn-8Zn-3Bi dan Sn-3Ag-0.5Cu) ke atas substrat kumprum tanpa salutan dan yang disalut dengan Au-Ni telah dilakukan. Keputusan menunjukkan kebolehbasahan bagi ketiga-tiga aloi pateri ke atas substrat kuprum adalah baik pada suhu yang telah ditetapkan. Ukuran sudut sentuh dan daya basahan menunjukkan pembasahan yang baik telah tercapai.
Properties of lead free solder alloys (Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu) on Au-Ni surface finished copper and copper substrates were investigated. Results obtained showed good wetting of all three solder alloys on Au-Ni surface finished substrate at appropriate temperatures. Contact angle measurement and wetting force results reaffirmed that good wetting of solder alloys on substrate was achieved. |
| first_indexed | 2025-11-15T17:45:09Z |
| format | Thesis |
| id | usm-41512 |
| institution | Universiti Sains Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T17:45:09Z |
| publishDate | 2009 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | usm-415122019-04-12T05:26:59Z http://eprints.usm.my/41512/ Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates Binh, Duong Ngoc TN1-997 Mining engineering. Metallurgy Pencirian aloi pateri tanpa plumbum (Sn-9Zn, Sn-8Zn-3Bi dan Sn-3Ag-0.5Cu) ke atas substrat kumprum tanpa salutan dan yang disalut dengan Au-Ni telah dilakukan. Keputusan menunjukkan kebolehbasahan bagi ketiga-tiga aloi pateri ke atas substrat kuprum adalah baik pada suhu yang telah ditetapkan. Ukuran sudut sentuh dan daya basahan menunjukkan pembasahan yang baik telah tercapai. Properties of lead free solder alloys (Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu) on Au-Ni surface finished copper and copper substrates were investigated. Results obtained showed good wetting of all three solder alloys on Au-Ni surface finished substrate at appropriate temperatures. Contact angle measurement and wetting force results reaffirmed that good wetting of solder alloys on substrate was achieved. 2009-11 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/41512/1/Duong_Ngoc_Binh24.pdf Binh, Duong Ngoc (2009) Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates. PhD thesis, Universiti Sains Malaysia. |
| spellingShingle | TN1-997 Mining engineering. Metallurgy Binh, Duong Ngoc Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates |
| title | Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
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| title_full | Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
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| title_fullStr | Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
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| title_full_unstemmed | Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
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| title_short | Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
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| title_sort | interfacial reactions and electromigration in lead-free solder joints with copper and au-ni surface finished copper substrates |
| topic | TN1-997 Mining engineering. Metallurgy |
| url | http://eprints.usm.my/41512/ http://eprints.usm.my/41512/1/Duong_Ngoc_Binh24.pdf |