APA (7th ed.) Citation

Binh, D. N. (2009). Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates.

Chicago Style (17th ed.) Citation

Binh, Duong Ngoc. Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates. 2009.

MLA (9th ed.) Citation

Binh, Duong Ngoc. Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates. 2009.

Warning: These citations may not always be 100% accurate.