Particle Removal In Post Chemical-Mechanical
Planarization (Cmp) Cleaning Process: Experimental And
Modeling Studies

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Particle Removal In Post Chemical-Mechanical Planarization (Cmp) Cleaning Process: Experimental And Modeling Studies

Proses pencucian pasca perataan secara mekanikal-kimia memainkan peranan penting dalam teknologi wafer kerana ia adalah salah satu objektif untuk menghasilkan permukaan yang berkualiti tinggi bagi dimensi yang halus. Kajian ini terdiri daripada eksperimen dan teori untuk menilai kecekapan penying...

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Bibliographic Details
Main Author:	Lok , Yian Han
Format:	Thesis
Language:	English
Published:	2009
Subjects:	TP1-1185 Chemical technology
Online Access:	http://eprints.usm.my/41279/ http://eprints.usm.my/41279/1/Lok_Yian_Han24.pdf

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