Investigation Of Wire Sweep During Pbga Encapsulation Process Using Fluid Structure Interaction

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Investigation Of Wire Sweep During Pbga Encapsulation Process Using Fluid Structure Interaction

The reduction of IC chip size has a significant impact to the modern electronic industry especially on the circuit design and IC assembly process. The increasing of I/O counts in a small scale IC chip result in severe wire deformation and deformation issues during transfer moulding process. In this...

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Bibliographic Details
Main Author:	Ramdan, Dadan
Format:	Thesis
Language:	English
Published:	2013
Subjects:	TJ1-1570 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/41166/ http://eprints.usm.my/41166/1/Dadan_Ramdan_24_Pages.pdf

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