Study Of Wave Soldering Using Thermal-Fluid Structure Interaction Technique On Pin Through Hole In Printed Circuit Board

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Study Of Wave Soldering Using Thermal-Fluid Structure Interaction Technique On Pin Through Hole In Printed Circuit Board

Wave soldering is one of the most familiar and well-established processes in the electronics assembly industry, which is used to assemble the pin-through hole (PTH) component onto the printed circuit board (PCB). The solder joint defects such as cracks, void formation, and incomplete filling of the...

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Bibliographic Details
Main Author:	Aziz, Mohd Sharizal Abdul
Format:	Thesis
Language:	English
Published:	2015
Subjects:	TJ1-1570 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/41161/ http://eprints.usm.my/41161/1/MOHD_SHARIZAL_BIN_ABDUL_AZIZ_24_Pages.pdf

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