Fabrication And Characterization Of Ag-Al Die Attach Material For Sic-Based High Temperature Device

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Fabrication And Characterization Of Ag-Al Die Attach Material For Sic-Based High Temperature Device

An Ag-Al nanopaste for high temperature die attach applications on SiC power devices has been developed. The Ag-Al nanopaste was studied by varying the Al weight percent in the Ag matrix as well as the organic additives content. The Ag-Al nanopaste was sintered in open air at 380°C for 30 minutes to...

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Bibliographic Details
Main Author:	Vemal , Raja Manikam
Format:	Thesis
Language:	English
Published:	2012
Subjects:	TA404 Composite materials
Online Access:	http://eprints.usm.my/41148/ http://eprints.usm.my/41148/1/VEMAL_RAJA_MANIKAM_24_Pages.pdf

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