Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications

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Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications

A silver-copper (Ag-Cu) nanopaste formulated by mixing Ag and Cu nanoparticles with organic additives (i.e., resin binder, terpineol and ethylene glycol) which is meant for high-temperature die-attach applications has been developed. Various weight percent of Cu nanoparticles (20-80 wt%) has been lo...

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Bibliographic Details
Main Author:	Tan , Kim Seah
Format:	Thesis
Language:	English
Published:	2015
Subjects:	TA404 Composite materials
Online Access:	http://eprints.usm.my/41125/ http://eprints.usm.my/41125/1/Tan_Kim_Seah_24_Pages.pdf

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