Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process

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Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process

Kini penyelidik mula menguatkan pateri tanpa plumbum dengan zarah nano bagi menghasilkan pateri komposit nano berkualiti tinggi. Kajian ke atas campuran pateri yang diperkuat nano dikehendaki oleh jurutera dan penyelidik bagi menyelesaikan masalah pateri terkini dan boleh meningkatkan kualiti sambun...

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Bibliographic Details
Main Author:	Chellvarajoo, Srivalli
Format:	Thesis
Language:	English
Published:	2016
Subjects:	T Technology TJ1-1570 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/40991/ http://eprints.usm.my/40991/1/Nano_Particle_Reinforced_Lead-Free_Sn%E2%80%933.0Ag%E2%80%930.5Cu_Solder_Paste_for_Reflow_Soldering_Process.pdf

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