Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow

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Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow

Solder bump bridging (SBB) is a type microprocessor packaging defects in Flip-Chip or C4 interconnection layer. The presence of micro conductive contaminate particle in die-package layer which causes bridging between two or more adjacent solder bump. These contaminate particles are mainly comes from...

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Bibliographic Details
Main Author:	Loo , Kean Ann
Format:	Thesis
Language:	English
Published:	2017
Subjects:	TK Electrical Engineering. Electronics. Nuclear Engineering TK1-9971 Electrical engineering. Electronics. Nuclear engineering
Online Access:	http://eprints.usm.my/39584/ http://eprints.usm.my/39584/1/LOO_KEAN_ANN_24_Pages.pdf

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