APA (7th ed.) Citation

Loo , K. A. (2017). Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow.

Chicago Style (17th ed.) Citation

Loo , Kean Ann. Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow. 2017.

MLA (9th ed.) Citation

Loo , Kean Ann. Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow. 2017.

Warning: These citations may not always be 100% accurate.