Finite Element Analysis On The Effect Of Solder
Joint Geometry For The Reliability Of Ball Grid Array Assembly With Flexible And Rigid PCBS

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Finite Element Analysis On The Effect Of Solder Joint Geometry For The Reliability Of Ball Grid Array Assembly With Flexible And Rigid PCBS

In the present study, three-dimensional (3D) finite element simulation on 132 PIN fleXBGATM package was performed to predict the effect of solder joint geometry on the reliability of Ball Grid Array (BGA) solder joints on flexible and rigid PCBs subjected to thermo-cyclic loading. The commercial...

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Bibliographic Details
Main Authors:	Lau, Chun Sean, Abdullah, M. Z., Mujeebu, M. Abdul, Yusof, N. Md
Format:	Article
Language:	English
Published:	Taylor's University 2014
Subjects:	TJ1-1570 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/39129/ http://eprints.usm.my/39129/1/FINITE_ELEMENT_ANALYSIS_ON_THE_EFFECT_OF_SOLDER.pdf

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