APA (7th ed.) Citation

Lau, C. S., Abdullah, M. Z., Mujeebu, M. A., & Yusof, N. M. (2014). Finite Element Analysis On The Effect Of Solder Joint Geometry For The Reliability Of Ball Grid Array Assembly With Flexible And Rigid PCBS. Taylor's University.

Chicago Style (17th ed.) Citation

Lau, Chun Sean, M. Z. Abdullah, M. Abdul Mujeebu, and N. Md Yusof. Finite Element Analysis On The Effect Of Solder Joint Geometry For The Reliability Of Ball Grid Array Assembly With Flexible And Rigid PCBS. Taylor's University, 2014.

MLA (9th ed.) Citation

Lau, Chun Sean, et al. Finite Element Analysis On The Effect Of Solder Joint Geometry For The Reliability Of Ball Grid Array Assembly With Flexible And Rigid PCBS. Taylor's University, 2014.