Electrical and Thermal Behavior of Copper-Epoxy Nanocomposites Prepared via Aqueous to Organic Phase Transfer Technique
The preparation, electrical, and thermal behaviors of copper-epoxy nanocomposites are described. Cetyltrimethylammonium bromide- (CTAB-) stabilized copper (Cu) particles were synthesized via phase transfer technique. Isopropanol (IPA), sodium borohydride (NaBH4), and toluene solution of diglycidyl...
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| Format: | Article |
| Language: | English |
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Hindawi Publishing Corporation
2012
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| Online Access: | http://eprints.usm.my/38942/ http://eprints.usm.my/38942/1/Electrical_and_Thermal_Behavior_of_Copper-Epoxy_Nanocomposites_Prepared_via_Aqueous_to_Organic.pdf |
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| author | Mohd Hirmizi, N. H. Abu Bakar, M. Tan, W. L. Abu Bakar, N. H. H. Ismail, J. See, C. H. |
| author_facet | Mohd Hirmizi, N. H. Abu Bakar, M. Tan, W. L. Abu Bakar, N. H. H. Ismail, J. See, C. H. |
| author_sort | Mohd Hirmizi, N. H. |
| building | USM Institutional Repository |
| collection | Online Access |
| description | The preparation, electrical, and thermal behaviors of copper-epoxy nanocomposites are described. Cetyltrimethylammonium
bromide- (CTAB-) stabilized copper (Cu) particles were synthesized via phase transfer technique. Isopropanol (IPA), sodium
borohydride (NaBH4), and toluene solution of diglycidyl ether of bisphenol A (DGEBA) were used as transferring, reducing agent,
and the organic phase, respectively. The UV-Vis absorbance spectra of all the sols prepared indicate that the presence of Cu particles
with the particles transfer efficiency is ≥97%. The amount, size, and size distribution of particles in the organosol were dependent
on the content of organic solute in the organosol. The composites were obtained upon drying the organosols and these were then
subjected to further studies on the curing, thermal, and electrical characteristic. The presence of Cu fillers does not significantly
affect the completeness of the composite curing process and only slightly reduce the thermal stability of the composites that is
>300◦C. The highest conductivity value of the composites obtained is 3.06 × 10−2 S cm−1. |
| first_indexed | 2025-11-15T17:34:03Z |
| format | Article |
| id | usm-38942 |
| institution | Universiti Sains Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T17:34:03Z |
| publishDate | 2012 |
| publisher | Hindawi Publishing Corporation |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | usm-389422018-02-14T08:10:24Z http://eprints.usm.my/38942/ Electrical and Thermal Behavior of Copper-Epoxy Nanocomposites Prepared via Aqueous to Organic Phase Transfer Technique Mohd Hirmizi, N. H. Abu Bakar, M. Tan, W. L. Abu Bakar, N. H. H. Ismail, J. See, C. H. QD1-999 Chemistry The preparation, electrical, and thermal behaviors of copper-epoxy nanocomposites are described. Cetyltrimethylammonium bromide- (CTAB-) stabilized copper (Cu) particles were synthesized via phase transfer technique. Isopropanol (IPA), sodium borohydride (NaBH4), and toluene solution of diglycidyl ether of bisphenol A (DGEBA) were used as transferring, reducing agent, and the organic phase, respectively. The UV-Vis absorbance spectra of all the sols prepared indicate that the presence of Cu particles with the particles transfer efficiency is ≥97%. The amount, size, and size distribution of particles in the organosol were dependent on the content of organic solute in the organosol. The composites were obtained upon drying the organosols and these were then subjected to further studies on the curing, thermal, and electrical characteristic. The presence of Cu fillers does not significantly affect the completeness of the composite curing process and only slightly reduce the thermal stability of the composites that is >300◦C. The highest conductivity value of the composites obtained is 3.06 × 10−2 S cm−1. Hindawi Publishing Corporation 2012 Article PeerReviewed application/pdf en http://eprints.usm.my/38942/1/Electrical_and_Thermal_Behavior_of_Copper-Epoxy_Nanocomposites_Prepared_via_Aqueous_to_Organic.pdf Mohd Hirmizi, N. H. and Abu Bakar, M. and Tan, W. L. and Abu Bakar, N. H. H. and Ismail, J. and See, C. H. (2012) Electrical and Thermal Behavior of Copper-Epoxy Nanocomposites Prepared via Aqueous to Organic Phase Transfer Technique. Journal of Nanomaterials, 2012 (219073). pp. 1-11. ISSN 1687-4110 https://doi.org/10.1155/2012/219073 |
| spellingShingle | QD1-999 Chemistry Mohd Hirmizi, N. H. Abu Bakar, M. Tan, W. L. Abu Bakar, N. H. H. Ismail, J. See, C. H. Electrical and Thermal Behavior of Copper-Epoxy Nanocomposites Prepared via Aqueous to Organic Phase Transfer Technique |
| title | Electrical and Thermal Behavior of Copper-Epoxy Nanocomposites Prepared via Aqueous to Organic Phase Transfer Technique |
| title_full | Electrical and Thermal Behavior of Copper-Epoxy Nanocomposites Prepared via Aqueous to Organic Phase Transfer Technique |
| title_fullStr | Electrical and Thermal Behavior of Copper-Epoxy Nanocomposites Prepared via Aqueous to Organic Phase Transfer Technique |
| title_full_unstemmed | Electrical and Thermal Behavior of Copper-Epoxy Nanocomposites Prepared via Aqueous to Organic Phase Transfer Technique |
| title_short | Electrical and Thermal Behavior of Copper-Epoxy Nanocomposites Prepared via Aqueous to Organic Phase Transfer Technique |
| title_sort | electrical and thermal behavior of copper-epoxy nanocomposites prepared via aqueous to organic phase transfer technique |
| topic | QD1-999 Chemistry |
| url | http://eprints.usm.my/38942/ http://eprints.usm.my/38942/ http://eprints.usm.my/38942/1/Electrical_and_Thermal_Behavior_of_Copper-Epoxy_Nanocomposites_Prepared_via_Aqueous_to_Organic.pdf |