Effects of Solder Temperature on Pin Through-Hole during
Wave Soldering: Thermal-Fluid Structure Interaction Analysis

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Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises...

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Bibliographic Details
Main Authors:	Abdul Aziz, M. S., Abdullah, M. Z., Khor, C. Y.
Format:	Article
Language:	English
Published:	Hindawi Publishing Corporation 2014
Subjects:	TJ1-1570 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/38922/ http://eprints.usm.my/38922/1/Effects_of_Solder_Temperature_on_Pin_Through-Hole_during_Wave_Soldering_Thermal-Fluid.pdf

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