Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process

This paper presents the investigation of the effects of epoxy moulding compound’ (EMC) viscosity on the FSI aspects during moulded underfill process (MUF). Finite volume (FV) code and finite element (FE) code were connected online through the Mesh-based Parallel Code Coupling Interface (MpCCI) m...

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Main Authors: Khor, C.Y., Ishak, Muhammad Ikman, Rosli, M.U., Jamalludin, Mohd Riduan, Zakaria, M.S, Yamin, A.F.M., Abdul Aziz, M.S., Abdullah, M.Z.
Format: Article
Language:English
Published: EDP Sciences 2017
Subjects:
Online Access:http://eprints.usm.my/37007/
http://eprints.usm.my/37007/1/%28Influence_of_Material_Properties%29_matecconf_etic2017_01059.pdf
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author Khor, C.Y.
Ishak, Muhammad Ikman
Rosli, M.U.
Jamalludin, Mohd Riduan
Zakaria, M.S
Yamin, A.F.M.
Abdul Aziz, M.S.
Abdullah, M.Z.
author_facet Khor, C.Y.
Ishak, Muhammad Ikman
Rosli, M.U.
Jamalludin, Mohd Riduan
Zakaria, M.S
Yamin, A.F.M.
Abdul Aziz, M.S.
Abdullah, M.Z.
author_sort Khor, C.Y.
building USM Institutional Repository
collection Online Access
description This paper presents the investigation of the effects of epoxy moulding compound’ (EMC) viscosity on the FSI aspects during moulded underfill process (MUF). Finite volume (FV) code and finite element (FE) code were connected online through the Mesh-based Parallel Code Coupling Interface (MpCCI) method for fluid and structural analysis. The EMC flow behaviour was modelled by Castro-Macosko model, which was written in C language and incorporated into the FV analysis. Real-time predictions on the flow front, chip deformation and stress concentration were solved by FV- and FE-solver. Increase in EMC viscosity raises the deformation and stress imposed on IC and solder bump, which may induce unintended features on the IC structure. The current simulation is expected to provide the better understandings and clear visualization of FSI in the moulded underfill process.
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institution Universiti Sains Malaysia
institution_category Local University
language English
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publishDate 2017
publisher EDP Sciences
recordtype eprints
repository_type Digital Repository
spelling usm-370072017-10-10T04:17:46Z http://eprints.usm.my/37007/ Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process Khor, C.Y. Ishak, Muhammad Ikman Rosli, M.U. Jamalludin, Mohd Riduan Zakaria, M.S Yamin, A.F.M. Abdul Aziz, M.S. Abdullah, M.Z. TJ1-1570 Mechanical engineering and machinery TL1-4050 Motor vehicles. Aeronautics. Astronautics This paper presents the investigation of the effects of epoxy moulding compound’ (EMC) viscosity on the FSI aspects during moulded underfill process (MUF). Finite volume (FV) code and finite element (FE) code were connected online through the Mesh-based Parallel Code Coupling Interface (MpCCI) method for fluid and structural analysis. The EMC flow behaviour was modelled by Castro-Macosko model, which was written in C language and incorporated into the FV analysis. Real-time predictions on the flow front, chip deformation and stress concentration were solved by FV- and FE-solver. Increase in EMC viscosity raises the deformation and stress imposed on IC and solder bump, which may induce unintended features on the IC structure. The current simulation is expected to provide the better understandings and clear visualization of FSI in the moulded underfill process. EDP Sciences 2017 Article PeerReviewed application/pdf en http://eprints.usm.my/37007/1/%28Influence_of_Material_Properties%29_matecconf_etic2017_01059.pdf Khor, C.Y. and Ishak, Muhammad Ikman and Rosli, M.U. and Jamalludin, Mohd Riduan and Zakaria, M.S and Yamin, A.F.M. and Abdul Aziz, M.S. and Abdullah, M.Z. (2017) Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process. MATEC Web of Conferences, 97 ( 01059). pp. 1-6. ISSN 2261-236X https://doi.org/10.1051/matecconf/20179701059
spellingShingle TJ1-1570 Mechanical engineering and machinery
TL1-4050 Motor vehicles. Aeronautics. Astronautics
Khor, C.Y.
Ishak, Muhammad Ikman
Rosli, M.U.
Jamalludin, Mohd Riduan
Zakaria, M.S
Yamin, A.F.M.
Abdul Aziz, M.S.
Abdullah, M.Z.
Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
title Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
title_full Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
title_fullStr Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
title_full_unstemmed Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
title_short Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
title_sort influence of material properties on the fluid-structure interaction aspects during molded underfill process
topic TJ1-1570 Mechanical engineering and machinery
TL1-4050 Motor vehicles. Aeronautics. Astronautics
url http://eprints.usm.my/37007/
http://eprints.usm.my/37007/
http://eprints.usm.my/37007/1/%28Influence_of_Material_Properties%29_matecconf_etic2017_01059.pdf