Experimental And Numerical Studies Of Transient Heat Transfer In Electronics Packaging

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Experimental And Numerical Studies Of Transient Heat Transfer In Electronics Packaging

The demand for mobile and tablet devices is at all time high for the last decade, overwhelming attention has been paid to this field, the novelty studies that needed in industry to accompany this demand is to characterize the steady state and transient studies for satisfactory thermal performance on...

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Bibliographic Details
Main Author:	Ong, Kean Aik
Format:	Thesis
Language:	English
Published:	2017
Subjects:	TJ1 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/36421/ http://eprints.usm.my/36421/1/Pages_from_ONG_KEAN_AIK_MFAR_24_PAGES.pdf

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