APA (7th ed.) Citation

Ong, K. A. (2017). Experimental And Numerical Studies Of Transient Heat Transfer In Electronics Packaging.

Chicago Style (17th ed.) Citation

Ong, Kean Aik. Experimental And Numerical Studies Of Transient Heat Transfer In Electronics Packaging. 2017.

MLA (9th ed.) Citation

Ong, Kean Aik. Experimental And Numerical Studies Of Transient Heat Transfer In Electronics Packaging. 2017.

Warning: These citations may not always be 100% accurate.