Solder Joint Reliability Of Flip Chip BGA Package

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Solder Joint Reliability Of Flip Chip BGA Package

Daya tahan hubungan bebola pateri merupakan satu kriteria keboleharapan yang penting dalam pempakejan elektronik moden. The integrity of ball and bump solder joints is a major reliability concern in modern micro electronic packages.

Bibliographic Details
Main Author:	Lee, Kor Oon
Format:	Thesis
Language:	English
Published:	2004
Subjects:	TA1-2040 Engineering (General). Civil engineering (General)
Online Access:	http://eprints.usm.my/3572/ http://eprints.usm.my/3572/1/Solder_Joint_Reliability_Of_Flip_Chip_BGA_Package-Lee_Kor_Oon-PPKM.pdf

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