APA (7th ed.) Citation

Lee, K. O. (2004). Solder Joint Reliability Of Flip Chip BGA Package.

Chicago Style (17th ed.) Citation

Lee, Kor Oon. Solder Joint Reliability Of Flip Chip BGA Package. 2004.

MLA (9th ed.) Citation

Lee, Kor Oon. Solder Joint Reliability Of Flip Chip BGA Package. 2004.

Warning: These citations may not always be 100% accurate.