Investigations On Silver-Copper
Nanopaste As Die-Attach Material For
High Temperature Applications

QR Code

Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications

Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan mencampurkan nanopartikel Ag dan Cu dengan penambah organik (pelekat resin, terpineol dan ethylene glycol) telah dihasilkan bagi diaplikasikan sebagai bahan lampir-dai suhu tinggi. Pelbagai peratus berat nanopartikel Cu (20-80 wt%) tela...

Full description

Bibliographic Details
Main Author:	Tan , Kim Seah
Format:	Thesis
Language:	English
Published:	2015
Subjects:	TN1-997 Mining engineering. Metallurgy
Online Access:	http://eprints.usm.my/30367/ http://eprints.usm.my/30367/1/Thesis_%28Tan_Kim_Seah%29.pdf

Similar Items

Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
by: Tan , Kim Seah
Published: (2015)

Optimization of silver nanoparticles sizes in ag-cu nanopaste as die-attach materials for high temperature applications
by: Noordin, Norasiah Mohammad
Published: (2017)

Synthesis, Characterization And Properties Of Silver Nanoparticles And Silver/Polyaniline Nanocomposites
by: Rajasingam, Ratnamalar
Published: (2015)

EBP 402/3 - MOULD & DIE DESIGN APR-MEI 09.
by: PPKBSM, Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral
Published: (2009)

Properties Of Silver-Filled Epoxy Composites For Electronic Application Using Synthesized And Commercial Silver Nanoparticles
by: Ghazali, Suriati
Published: (2012)

Study Of The Redox And Acid-Base Properties Of Soda-Lime Silicate Glass: Application To The High Temperature Corrosion Of Nickel-Based Alloys And Ceramic Materials
by: Abdullah, Tuti Katrina
Published: (2014)

Effect Of Nitric-Oxide Post-Oxidation Annealing On High-Temperature Oxidized 4H SiC.
by: Jeong, Hyun Moon, et al.
Published: (2007)

EBP 402/3 - MOULD & DIE DESIGN [REKABENTUK ACUAN & DAI] APR-MEI 2011.
by: PPKBSM, Pusat Pengajian Kejuruteraan Bahan Dan Sumber Mineral
Published: (2011)

EBP 402/3 - MOULD & DIE DESIGN [REKABENTUK ACUAN & DAI] APR-MEI 2010.
by: PPKBSM, Pusat Pengajian Kejuruteraan Bahan Dan Sumber Mineral
Published: (2010)

Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
by: Binh, Duong Ngoc
Published: (2009)

Properties Of Silver Filled Epoxy Composites For Electrical Conductive Adhesive Applications
by: Shariff, Khairul Anuar
Published: (2011)

Effect Of Nb, Cr And W On The High Temperature Oxidation Behavior Of Ti-Al Alloys
by: Sapiai, Napisah
Published: (2011)

Effect Of Resistance Spot Welding Parameters On Copper And Brass
by: Saad, Nurihal Hanim Mat
Published: (2012)

Preparation and characterization of high-K dieletric material of CCTO by using microwave processing technique.
by: Hutagalung, Sabar Derita
Published: (2008)

Investigation Of Magnesium Doped Calcium Copper Titanate (Cacu3ti4o12) On Ca And Cu Site Prepared By Solid State Reaction Method
by: Rahman, Mohd Fariz Ab
Published: (2013)

Synthesis And Optimization Of Copper Oxide As P-Type Transparent Conducting Oxide
by: Jani, Nur Aimi
Published: (2010)

Production Of Gold And Silver Nanoparticles Recovered Through Sonication Of Reflective Metal Layer In Cd-R Waste
by: Ahmad, Azliyana
Published: (2013)

Processing, Microstructure And Properties Of In Situ Copper Reinforced Tungsten Carbide Nanostructured Composite
by: Yusoff, Mahani
Published: (2012)

Development Of Nanocrysta Lite Cati03 Via High Intensity Grinding Using Value Added Local Raw Materials.
by: Palaniandy, Samayamutthirian, et al.
Published: (2008)

Fabrication And Characterisation Of Copper Composites Reinforced With Transition Metal Carbides Via Mechanical Alloying
by: Subhi, Nur Hawadah Mohd
Published: (2011)

Preparation Of In-Situ Carbides Reinforced Hybrid Copper-Based Composite By Mechanical Alloying And Its Characterization
by: Le , Minh Hai
Published: (2010)

Characterization and Photocatalytic Activity of Enhanced Copper-Silica-Loaded Titania Prepared via HydrothermalMethod
by: Poliah, Ramarao, et al.
Published: (2011)

Equal Channel Angular Pressing (ECAP) Process Of Copper Electrodes For Resistance Spot Brazing Application.
by: Thien Ly, Tran Thi
Published: (2007)

The Effect Of Surface Modification On Activated Carbon Using Citric Acid And Nitric Acid For Copper Removal
by: Hasan, Norwanis
Published: (2007)

Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate
by: M.A., Rabiatul Adawiyah, et al.
Published: (2020)

Design Of Low Phase Noise Very High Frequency (VHF) Low Band Voltage Controlled Oscillator (VCO) For Transceiver Application
by: Yeap, Kim Huat
Published: (2011)

Advances in Smart Materials and Applications
by: Kuan, Yew Cheong, et al.
Published: (2014)

Effect Of Lanthanum Oxide (La2O3) Addition On The Properties Of Calcium Copper Titanate (CaCu3Ti4O12)
by: Sharif, Nur Shafiza Afzan
Published: (2010)

EBB236-3 - MATERIALS THERMODYNAMIC - NOVEMBER 2008.
by: PPKBSM, Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral
Published: (2008)

EBB 113-3 - ENGINEERING MATERIALS NOV 2008
by: PPKBSM, Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral
Published: (2008)

EBB 236-3 - MATERIALS THERMODYNAMIC NOV 2008
by: PPKBSM, Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral
Published: (2008)

EBB 524/3 – COMPOSITE MATERIALS NOV 2009
by: PPKBSM, Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral
Published: (2009)

EBB 524/3 - COMPOSITE MATERIALS JUNE 2010
by: PPKBSM, Pusat pengajian Kejuruteraan Bahan dan Sumber Mineral
Published: (2010)

Assessment Of Alumina And Muscovite As Fillers For Epoxy Substrate Material
by: Abdul Rashid, Erfan Suryani
Published: (2009)

EBB 524/3 – Composite Materials January 2012
by: PPKBSM, Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral
Published: (2012)

EBB 524/3 - COMPOSITE MATERIALS NOV 2010.
by: PPKBSM, Pusat Pengajian Kejuruteraan Bahan Dan Sumber Mineral
Published: (2010)

EBB 524/3 - COMPOSITE MATERIALS JAN. 2012
by: PPKBSM, Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral
Published: (2012)

EBB 204-3 - ELASTOMERIC MATERIALS APRIL 08
by: PPKBSM, Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral
Published: (2008)

EBB245-3 - CHARACTERISATION OF ENGINEERING MATERIALS - NOVEMBER 2008.
by: PPKBSM, Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral
Published: (2008)

EBB 215/3 - SEMICONDUCTOR MATERIALS APR-MEI 09.
by: PPKBSM, Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral
Published: (2009)