Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization

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Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization

Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection.

Bibliographic Details
Main Author:	Mayappan, Ramani
Format:	Thesis
Language:	English
Published:	2007
Subjects:	Q Science
Online Access:	http://eprints.usm.my/29392/ http://eprints.usm.my/29392/1/Study_on_the_wetting_properties%2C_interfacial_reactions_and_mechanical.pdf

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