Heat Pipes In Electronic Packaging

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Heat Pipes In Electronic Packaging

Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes.

Bibliographic Details
Main Author:	Munusamy, Sri Jaiandran
Format:	Thesis
Language:	English
Published:	2006
Subjects:	Q Science
Online Access:	http://eprints.usm.my/29322/ http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf

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