Design Of Crack Detection System Software For IC Package
Using Blob Analysis And Neural Network.

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Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.

In this research, three methods for the detection of crack defects on integrated circuit (IC) packages are proposed. These methods use blob analysis technique in image processing stage, and use multi-layered perceptron (MLP) neural network to classify the IC package.

Bibliographic Details
Main Authors:	Samad, Rosdiyana, Arshad, Mohd Rizal, Samad, Zahurin
Format:	Conference or Workshop Item
Language:	English
Published:	2005
Subjects:	TK1-9971 Electrical engineering. Electronics. Nuclear engineering
Online Access:	http://eprints.usm.my/14359/ http://eprints.usm.my/14359/1/design.pdf

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