Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.
In this research, three methods for the detection of crack defects on integrated circuit (IC) packages are proposed. These methods use blob analysis technique in image processing stage, and use multi-layered perceptron (MLP) neural network to classify the IC package.
| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2005
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| Subjects: | |
| Online Access: | http://eprints.usm.my/14359/ http://eprints.usm.my/14359/1/design.pdf |
| _version_ | 1848872009708077056 |
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| author | Samad, Rosdiyana Arshad, Mohd Rizal Samad, Zahurin |
| author_facet | Samad, Rosdiyana Arshad, Mohd Rizal Samad, Zahurin |
| author_sort | Samad, Rosdiyana |
| building | USM Institutional Repository |
| collection | Online Access |
| description | In this research, three methods for the detection of crack defects on integrated circuit (IC) packages are proposed. These methods use blob analysis technique in image processing stage, and use multi-layered perceptron (MLP) neural network to classify the IC package.
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| first_indexed | 2025-11-15T15:49:09Z |
| format | Conference or Workshop Item |
| id | usm-14359 |
| institution | Universiti Sains Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T15:49:09Z |
| publishDate | 2005 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | usm-143592017-11-20T07:22:09Z http://eprints.usm.my/14359/ Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network. Samad, Rosdiyana Arshad, Mohd Rizal Samad, Zahurin TK1-9971 Electrical engineering. Electronics. Nuclear engineering In this research, three methods for the detection of crack defects on integrated circuit (IC) packages are proposed. These methods use blob analysis technique in image processing stage, and use multi-layered perceptron (MLP) neural network to classify the IC package. 2005 Conference or Workshop Item PeerReviewed application/pdf en http://eprints.usm.my/14359/1/design.pdf Samad, Rosdiyana and Arshad, Mohd Rizal and Samad, Zahurin (2005) Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network. In: Proceedings of the 9th WSEAS International CSCC Multiconference : Circuits ’05, System ’05, Computer ’05, Communication ‘05, , 11-16 July 2005 , Vouliagmeni, Athens, Greece. |
| spellingShingle | TK1-9971 Electrical engineering. Electronics. Nuclear engineering Samad, Rosdiyana Arshad, Mohd Rizal Samad, Zahurin Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network. |
| title | Design Of Crack Detection System Software For IC Package
Using Blob Analysis And Neural Network.
|
| title_full | Design Of Crack Detection System Software For IC Package
Using Blob Analysis And Neural Network.
|
| title_fullStr | Design Of Crack Detection System Software For IC Package
Using Blob Analysis And Neural Network.
|
| title_full_unstemmed | Design Of Crack Detection System Software For IC Package
Using Blob Analysis And Neural Network.
|
| title_short | Design Of Crack Detection System Software For IC Package
Using Blob Analysis And Neural Network.
|
| title_sort | design of crack detection system software for ic package
using blob analysis and neural network. |
| topic | TK1-9971 Electrical engineering. Electronics. Nuclear engineering |
| url | http://eprints.usm.my/14359/ http://eprints.usm.my/14359/1/design.pdf |