Computational Methods In Flip Chip Assembly.

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Computational Methods In Flip Chip Assembly.

Flip chip technology, in the book edited by Lau (Lau, 1995) is defined as placing a chip to the substrate by flipping over the chip so that the I/O area of the chip is facing the substrate. By flipping over the chip, the interconnection between the chip and the substrate are achieved by conductive &...

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Bibliographic Details
Main Authors:	Hj Abdul Azid, Assoc. Prof. Dr Ishak, Seetharamu, Prof. K.N., Abdul Quadir, Assoc. Prof. Dr Ghulam
Format:	Monograph
Published:	Universiti Sains Malaysia 2002
Subjects:	TJ1 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/10662/

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