Computational Methods In Flip Chip Assembly.
Flip chip technology, in the book edited by Lau (Lau, 1995) is defined as placing a chip to the substrate by flipping over the chip so that the I/O area of the chip is facing the substrate. By flipping over the chip, the interconnection between the chip and the substrate are achieved by conductive &...
| Main Authors: | , , |
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| Format: | Monograph |
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Universiti Sains Malaysia
2002
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| Online Access: | http://eprints.usm.my/10662/ |
| _version_ | 1848871028482113536 |
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| author | Hj Abdul Azid, Assoc. Prof. Dr Ishak Seetharamu, Prof. K.N. Abdul Quadir, Assoc. Prof. Dr Ghulam |
| author_facet | Hj Abdul Azid, Assoc. Prof. Dr Ishak Seetharamu, Prof. K.N. Abdul Quadir, Assoc. Prof. Dr Ghulam |
| author_sort | Hj Abdul Azid, Assoc. Prof. Dr Ishak |
| building | USM Institutional Repository |
| collection | Online Access |
| description | Flip chip technology, in the book edited by Lau (Lau, 1995) is defined as placing a chip to the substrate by flipping over the chip so that the I/O area of the chip is facing the substrate. By flipping over the chip, the interconnection between the chip and the substrate are achieved by conductive "bumps" placed directly in between the die surface and the substrate. Therefore, the whole chip surface can be utilized for active interconnections and at the same time, eliminates
the need for wire bonding.
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| first_indexed | 2025-11-15T15:33:34Z |
| format | Monograph |
| id | usm-10662 |
| institution | Universiti Sains Malaysia |
| institution_category | Local University |
| last_indexed | 2025-11-15T15:33:34Z |
| publishDate | 2002 |
| publisher | Universiti Sains Malaysia |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | usm-106622017-05-15T08:13:38Z http://eprints.usm.my/10662/ Computational Methods In Flip Chip Assembly. Hj Abdul Azid, Assoc. Prof. Dr Ishak Seetharamu, Prof. K.N. Abdul Quadir, Assoc. Prof. Dr Ghulam TJ1 Mechanical engineering and machinery Flip chip technology, in the book edited by Lau (Lau, 1995) is defined as placing a chip to the substrate by flipping over the chip so that the I/O area of the chip is facing the substrate. By flipping over the chip, the interconnection between the chip and the substrate are achieved by conductive "bumps" placed directly in between the die surface and the substrate. Therefore, the whole chip surface can be utilized for active interconnections and at the same time, eliminates the need for wire bonding. Universiti Sains Malaysia 2002-08 Monograph NonPeerReviewed Hj Abdul Azid, Assoc. Prof. Dr Ishak and Seetharamu, Prof. K.N. and Abdul Quadir, Assoc. Prof. Dr Ghulam (2002) Computational Methods In Flip Chip Assembly. Project Report. Universiti Sains Malaysia. |
| spellingShingle | TJ1 Mechanical engineering and machinery Hj Abdul Azid, Assoc. Prof. Dr Ishak Seetharamu, Prof. K.N. Abdul Quadir, Assoc. Prof. Dr Ghulam Computational Methods In Flip Chip Assembly. |
| title | Computational Methods In Flip Chip Assembly. |
| title_full | Computational Methods In Flip Chip Assembly. |
| title_fullStr | Computational Methods In Flip Chip Assembly. |
| title_full_unstemmed | Computational Methods In Flip Chip Assembly. |
| title_short | Computational Methods In Flip Chip Assembly. |
| title_sort | computational methods in flip chip assembly. |
| topic | TJ1 Mechanical engineering and machinery |
| url | http://eprints.usm.my/10662/ |