Computational methods in Flipchip assembly.
Flip chip technology, in the book edited by Lau (Lau, 1995) is defined as placing a chip to the substrate by flipping over the chip so that the I/O area of the chip is facing the substrate. By flipping over the chip, the interconnection between the chip and the substrate are achieved by conductive...
| Main Authors: | Hj Abdul Azid, Ishak, Seetharamu, K.N., Abdul Quadir, Ghulam |
|---|---|
| Format: | Monograph |
| Published: |
Universiti Sains Malaysia
2002
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| Subjects: | |
| Online Access: | http://eprints.usm.my/10584/ |
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