An Expert System for Trouble Shooting - Auto Wire Bonder Machine

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An Expert System for Trouble Shooting - Auto Wire Bonder Machine

An expert system to trouble shoot auto Wire bonder machine has been developed at Dpak product line, Motorola Semiconductor Sdn. Bhd., Seremban. This expert system is to provide a systematic and analytical procedure to trouble shoot Delvotec 6830 auto wire bonder. A rule-based expert system using...

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Bibliographic Details
Main Author:	Ng, Yu Ting
Format:	Thesis
Language:	English English
Published:	1997
Subjects:	Wire bonding (Electronic packaging) - Case studies
Online Access:	http://psasir.upm.edu.my/id/eprint/9996/ http://psasir.upm.edu.my/id/eprint/9996/1/FK_1997_3_A.pdf

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